Spring at Tisch
Study away for one semester in New York City and pursue your artistic passions.
Spring at Tisch is a full-time program for visiting undergraduate students from other colleges and universities. Spend your spring semester away from your home campus and take beginners-level courses at Tisch School of the Arts in areas such as cinema studies, interactive media arts, photography, or theatre production and design.
Experiment with new ways of storytelling and collaborate with students from around the world. You will take classes with Tisch faculty of artists and scholars, focusing on an artistic discipline and completing a core track of study and companion courses for 12-18 credits. All courses are for undergraduate credit and classes are held in Greenwich Village or Brooklyn, depending on your artistic discipline.
Live on or off campus during your spring semester at Tisch in one of many exciting neighborhoods in New York City. You will be inspired by the educational and cultural resources all around you.
The spring 2025 application is closed.
Effective May 2023, NYU no longer requires COVID-19 vaccinations. However, staying up to date with COVID-19 vaccinations, including booster shots, remains strongly recommended for the health and safety of the student and the campus community—and students are welcome to wear masks anytime they choose. More information about COVID-19 protocols at NYU, including updates, is available on the NYU COVID-19 Information website.
Spring at Tisch Programs of Study
Life at Tisch & in NYC
Students in need of accessibility-related information who are considering the Spring at Tisch program should contact the Moses Center for Student Accessibility. An Accessibility Specialist is available via Zoom each weekday (excluding University holidays) from 1:00 p.m. - 2:00 p.m. ET to discuss accessibility and possible accommodations at NYU. Email mosescsa@nyu.edu to request a Zoom link. Additional information and resources are available on the Moses Center for Student Accessibility website.